工作描述:
1. 封装材料选型,认可,新材料的合作开发。材料包括转模注塑料、烧结银材料、敷铜陶瓷基板等
Packaging material selection, release, new materials co-develop. Material including molding material, sintering material, AMB, etc
2. 牵头特定材料选型开发,制定明确开发计划,设计详细DOE验证试验
Leading specific material development, make clear develop plan, design detail DOE verification test
3. 研究封装材料重要物性的表征
Research on key property characterization of packaging material
4. 研究封装材料选型、结构设计与功率模块性能要求的关系
Research on relationship between packaging material, structure design and power module performance requirement
5. 研究封装材料的工艺性,深入了解转模注塑,烧结,回流焊接等相关封装工艺
Research on material process performance, master related packaging process, such as molding, sintering, reflow soldering, etc
6. 研究封装材料(焊料,烧结银,转模注塑料……)仿真(本构)模型
Research on material (solder, sinter silver, molding compound…) simulation (constitutive) model
7. 研究封装材料失效机理和失效模式,根据材料的应用工况建立封装材料可靠性模型
Research on material failure mode and failure mechanism, build up material reliability model based on material application condition
8. 分析和评估材料的生产稳定性
Analyze and evaluate material production stability
职位要求:
1. 电子封装技术,机械设计,材料工程等功率模块封装相关专业硕士及以上学历;
Master degree or above, major in Material engineering and semi-conductor related area
2. 具备功率模块封装开发经验,工作经验大于5年;
More than 5 years Power module related development experience.
3. 精通材料分析方法,如SEM,XPS,热分析等;
Proficiency in material analysis methods (SEM, XPS, thermal analysis, etc.)
4. 诚实、积极主动、创新、具备快速学习能力;
Be honest, active, innovative and quick learner.
5. 良好的沟通,团队合作及英语水平。
Good communication, teamwork and English skills.
收藏
取消收藏
已投递